Digital Humanities Associate Fellowship

Location:
Washington D.C.,
United States
Term: Academic Year

A nine-month fellowship program in Washington D.C. for students interested in the use of of Digital Humanities (DH) in Holocaust research and teaching.

The United States Holocaust Memorial Museum's Jack, Joseph and Morton Mandel Center for Advanced Holocaust Studies and the William Levine Family Institute for Holocaust Education offers a nine-month fellowship program to students interested in the use of technology for research and teaching in all academic disciplines, including history, political science, literature, Jewish studies, computer science, psychology, sociology, geography, and others.

The Digital Humanities Associate Fellowship (DHAF) recognizes the increasing importance and use of Digital Humanities (DH) in Holocaust research and teaching and supports its practices, possibilities, and applications for the field and the Museum.The fellowship is designed for students currently enrolled in a master’s degree program or completing their undergraduate education. Students who have completed more than one year of doctoral work will not be considered.

While at the Museum, DHA Fellows develop and conduct independent research projects under the supervision of a Museum mentor, interact with staff and visiting scholars in residence, and audit special summer seminars and research workshops. Activities span the Museum’s DC locations and the David and Fela Shapell Family Collections, Conservation, and Research Center in suburban Maryland.

Residency Requirements

DHA Fellows are required to be in residence at the Museum for nine months and will receive a stipend of $3,000/month.

Fact Sheet

Discipline:
Humanities, Social Sciences
Eligibility:
Columbia Graduate Students, Columbia Undergraduates, Fellowships, Senior, U.S. Citizen, U.S. Permanent Resident
Fellowship Type:
Experiential
Location:
Washington D.C.,
United States
Region:
North America
Term:
Academic Year

Dates & Deadlines

Academic Year
2024
Application Deadline: 
Wednesday, March 1, 2023